PCBTN.COM-專業技術-基於無鉛焊料下的01005元件PCB設計與組裝過程研究3

剪切測試：剪切測試所使用的樣品是首次實驗中的01005電阻。使用SnPb焊膏與ENIG（無電鍍鎳浸金）塗層的PCB板。剪切速率為500 μm/sec。剪切高度為50 μm。所有的最小失效模型見（表3）。包括陶瓷體破裂，焊點與焊盤的最終分離以及焊點斷裂。結論：在設計和製造中使用01005元件是可能的。整個過程與0201元件類似。在全部工藝過程優化後，選擇C型焊盤可以保證很高的良率。印刷過程中使用厚度為100μm的摸板。01005元件同樣可以使用盤卷方式包裝。迴流過程中需要使用氮氣環境來促進潤濕。由於元件尺寸小造成的焊膏沉積量相對較少，因此在整個過程中要注意保持助焊劑的活性。下一步的研究課題是對在空氣環境中01005元件的迴流進行過程優化。（本文最早刊登在SMTA國際會議論文集中。已經獲得授權使用）

參考文獻：D. Shangguan, 「0201 Assembly Capability for Miniaturization: FromDesign to Volume Manufacturing,」Proceedings of 2003 InternationalPrinted Circuit&Electronics Assembly Fair Technical Conference andExhibition, December 2003.D. Geiger, F. Mattsson, D. Shangguan, M. Ong, P.Wong, M. Wang, T.Castello and S. Yi, 「Process Characterization of PCB Assembly Using0201 Packages With Lead-Free Solder,」 Soldering & Surface MountTechnology, 2003. (Also, Nepcon West Proceedings, December 2002.)D.A. Geiger, M. Wang, D. Shangguan, T. Castello and F. Mattson,「Reliability Study of Solder Joints for 0201 Components,」 SMTAInternational Conference Proceedings, September 2003.M. Wang, D. Shangguan, M.T. Ong, F. Mattsson, D.Geiger and S. Yi,「Assembly Process Qualification on 0201 Packages for VolumeManufacturing,」SMTA International Conference Proceedings, September 2002.M. Wang, D. Shangguan, D. Geiger, F. Mattsson and S.Yi, 「PCB DesignOptimization of 0201 Packages for Assembly Processes,」 SMTA/IMAPSTelecomm Hardware Solutions Conference & Exhibition Proceedings,May 2002.M. Wang, D. Shangguan, D. Geiger, K. Nakajima, C.C.Ho and S. Yi,「Board Design and Assembly Process Evaluation for 0201 Components onPCBs,」 ApexProceedings, January 2002.M. Wang, D. Geiger, K. Nakajima, D. Shangguan, C.C.Ho and S. Yi,「Investigation of Printing Issues and Stencil Design for 0201 Package,」SMTA International Conference Proceedings, October 2001.
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